RingMaster™ Ultrasonic Bonder

The RingMaster™ ultrasonic bonder is a highly efficient bonder developed for manufacturers of bag filters for chemical and industrial liquid applications. Using three 20 kHz ultrasonic modules and 1500-watt power supplies, the equipment joins the bag to a rigid plastic circular frame, producing a dependable 360° bond. The 2-step process is accomplished in less than 10 seconds, without the use of consumables such as adhesives or thread. Custom tooling is available to accommodate a variety of bag sizes and ring diameters.

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Product Details

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Sonobond Ultrasonics
1191 McDermott Drive
West Chester, PA USA 19380